IEC 61189-5-601 pdf – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61189-5-601 pdf – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
IEC 60191-6-2,Mechanical standardization of semiconductor devices – Part 6-2: General rulesfor the preparation of outline drawings of surface mounted semiconductor devices packages -Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-5,Mechanical standardization of semiconductor devices – Part 6-5:General rules
for the preparation of outline drawings of surface mounted semiconductor device packages -Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-19,Mechanical standardization of semiconductor devices – Part6-19:Measurement methods of the package warpage at elevated temperature and the maximumpermissible warpage
IEC 60194-1 1，Printed boards design,manufacture and assembly – Vocabulary – Part 1:Common usage in printed board and electronic assembly technologies
IEC 60194-2， Printed boards design，manufacture and assembly – Vocabulary – Part 2:Common usage in electronic technologies as well as printed board and electronic assemblytechnologies
IEC 61190-1-3， Attachment materials for electronic assembly – Part 1-3: Requirements forelectronic grade solder alloys and fluxed and non-fluxed solid solder for electronic solderingapplications
IEC 62137-3，Electronics assembly technology – Part 3: Selection guidance of environmentaland endurance test methods for solder joints
3Terms and definitions
For the purposes of this document,the terms and definitions given in lEC 60191-6-2,IEC 60191-6-5,IEC 60194-1 and IEC 60194-2, as well as the following, apply.
For the purposes of this document, the following terms and definitions apply.
IsO and lEC maintain terminological databases for use in standardization at the followingaddresses:
.IEC Electropedia: available at http://www.electropedia.orgl
.Iso Online browsing platform: available at http://www.iso.orglobp
3.1
solderability
ability of the lead or termination of a component or electrode of a component or printed boardto be wetted by solder at the temperature of the lead, termination or electrode, which is assumedto be the lowest temperature in the soldering process, within the applicable temperature rangeof the solder alloy
Note 1 to entry. The term “solderability”is often used in combination with the term “test，indicating a specificmethod to evaluate the wettability or abiliy to be soldered of a surface under worst case condtions(solderingtemperature and contact time with solder). it is not to be confused with the concepts “soldering ability”(see 3.3.3.2
wettability
intrinsic property of the termination material to form an alloy with the solder