IEC 61189-5-601 pdf – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61189-5-601 pdf – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards IEC 60191-6-2,Mechanical standardization of semiconductor devices – Part 6-2: General rulesfor the preparation of outline drawings of...